Roll mold, method for fabricating the same and method for fabricating thin film pattern using the same

ABSTRACT

Discussed are a roll mold, a method for fabricating the same and a method for fabricating a thin film pattern using the same, which can prevent dimensional variation of the mold and simplify the overall process. The method for fabricating a thin film pattern includes providing a roll mold having a base roller provided with a light source, an adhesive resin layer formed on the base roller, a buffer layer formed on the adhesive resin layer, and a mold surface layer having a groove-protrusion shape formed on the buffer layer; forming a printing liquid on the roll mold or the substrate; and rolling the roll mold over the substrate to form a thin film pattern on the substrate. Also, the mold surface layer and the adhesive resin layer can be cured through light emitted from the light source arranged in the base roller.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of co-pending U.S. application Ser. No.13/204,265 filed on Aug. 5, 2011, which claims the priority benefit ofKorean Patent Application No. 10-2010-0078308, filed on Aug. 13, 2010,which are all hereby incorporated by reference as if fully set forthherein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a roll mold, a method for fabricatingthe same and a method for fabricating a thin film pattern using thesame.

2. Discussion of the Related Art

A variety of flat panel display devices to reduce weight and volume ofthe problems of cathode ray tubes have been introduced. Examples of flatpanel display devices include liquid crystal display devices, fieldemission display devices, plasma display panel devices andelectroluminescent (EL) display devices.

Such a flat panel display device includes a plurality of thin filmsformed by a mask process including a series of deposition (coating),exposure to light, developing and etching processes. However, the maskprocess is complicated, thus disadvantageously increasing fabricationcosts. Accordingly, recently, research into formation of thin films byan imprinting process using a roll mold 10, as illustrated in FIG. 1, isunderway.

Such a roll mold 10 is formed by patterning the surface of a base roller14 via an etching process. Specifically, an etch-protecting layer and amask pattern are formed on the surface of the base roller 14. Next, theetch-protecting layer is patterned through a primary etching processusing the mask pattern as a mask. The surface of the base roller 14 ispatterned by a secondary etching process using the patternedetch-protecting layer as a mask to obtain a roll mold 10 provided with agroove 12.

The roll mold 10 requires two etching processes, thus complicating theoverall manufacturing process. The diameter of the base roller 14 isdecreased through two etching processes, thus disadvantageously causingvariation in the final size of the roll mold 10 and deformation thereof.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a roll mold, a methodfor fabricating the same and a method for fabricating a thin filmpattern using the same that substantially obviate one or more problemsdue to limitations and disadvantages of the related art.

It is one object of the present invention to provide a roll mold, amethod for fabricating the same and a method for fabricating a thin filmpattern using the same, to prevent dimensional variation of the rollmold and simplify the overall manufacturing process.

To achieve the object and other advantages and in accordance with thepurpose of the invention, as embodied and broadly described herein,provided is a method for fabricating a roll mold including: providing asubstrate provided with a master pattern layer; sequentially forming amold surface layer and a solid buffer layer on the substrate providedwith the master pattern layer to provide a flat panel mold; forming anadhesive resin layer on the base roller aligned on the flat panel mold;and rolling the base roller provided with the adhesive resin layer overthe flat panel mold to adhere the flat panel mold to the base rollerthrough the adhesive resin layer.

The surface of the master pattern layer contacting the mold surfacelayer may be surface-treated with a hydrophobic material such asflurooctyl-trichloro-silane (FOTS) or(heptadecafluoro-1,1,2,3-tetrahydrodecyl)trichlorosilane (RDFS).

In one embodiment, the step of providing the flat panel mold mayinclude: forming the mold surface layer on the master pattern layer;forming the buffer layer on the mold surface layer, while one end of theflexible substrate is adhered to an unwinder and the other end of theflexible substrate is adhered to a rewinder and keeping the buffer layerlevel; rolling the base roller over the buffer layer and curing the moldsurface layer using a light source arranged in the base roller; andcutting the buffer layer to a size of the mold surface layer, whereinthe adhesion of the flat panel mold to the base roller through theadhesive resin layer further includes: curing the adhesive resin layerusing the light source in the base roller.

In another embodiment, the step of providing the flat panel mold mayinclude: forming the mold surface layer on the master pattern layer;forming the buffer layer on the mold surface layer, while one end of theflexible substrate is adhered to an unwinder and the other end of theflexible substrate is adhered to a rewinder and keeping the buffer layerlevel; and cutting the buffer layer to a size of the mold surface layer,and wherein the adhesion of the flat panel mold to the base rollerthrough the adhesive resin layer further includes: curing the moldsurface layer and the adhesive resin layer using the light sourcearranged in the base roller.

In accordance with another aspect of the present invention, provided isa roll mold including: a base roller provided with a light source; anadhesive resin layer formed on the base roller; a buffer layer formed onthe adhesive resin layer; and a mold surface layer having agroove-protrusion shape formed on the buffer layer, wherein the moldsurface layer and the adhesive resin layer are cured through lightemitted from the light source arranged in the base roller.

The mold surface layer may be made of a photocurable mold resin such asurethane-acrylate or polydimethylsiloxane, the buffer layer may beformed of a flexible substrate, and the adhesive resin layer may be madeof a photocurable adhesive.

In accordance with another aspect of the present invention, provided isan apparatus for fabricating a roll mold, including: a stage, on which asubstrate provided with a master pattern layer is mounted; a firstsupply nozzle to apply a liquid mold surface layer onto the masterpattern layer; an unwinder and a rewinder to fix both ends of the liquidbuffer layer, such that the solid buffer layer is formed on the liquidmold surface layer, while maintaining the solid buffer layer level; adicing unit to cut the buffer layer to the same size as the mold surfacelayer; and a second supply nozzle to apply a liquid mold surface layeronto the base roller rolling over the buffer layer.

The apparatus may further include: a light source arranged in the baseroller, the light source curing the liquid mold surface layer and theliquid adhesive resin layer; and a camera removably adhered to the baseroller, to align the base roller on the buffer layer.

In accordance with another aspect of the present invention, provided isa method for fabricating a thin film pattern, including: providing aroll mold comprising a base roller provided with a light source, anadhesive resin layer formed on the base roller, a buffer layer formed onthe adhesive resin layer, and a mold surface layer having agroove-protrusion shape formed on the buffer layer; forming a printingliquid on the roll mold or the substrate; and rolling the roll mold overthe substrate to form a thin film pattern on the substrate, wherein themold surface layer and the adhesive resin layer are cured through lightemitted from the light source arranged in the base roller.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the invention andalong with the description serve to explain the principle of theinvention. In the drawings:

FIG. 1 is a sectional view illustrating a conventional roll mold;

FIG. 2 is a perspective view illustrating a printing or imprintingdevice for forming a thin film pattern according to the presentinvention;

FIGS. 3A to 3E are sectional views illustrating a method for fabricatingthe roll mold illustrated in FIG. 2 according to a first embodiment;

FIGS. 4A to 4D are sectional views illustrating a method for fabricatingthe roll mold shown in FIG. 2 according to a second embodiment;

FIGS. 5A to 5C are views illustrating a method for patterning a thinfilm via an imprinting method employing the roll mold of the presentinvention according to a first embodiment;

FIGS. 6A to 6C are views illustrating a method for patterning a thinfilm via a printing method employing the roll mold of the presentinvention according to a second embodiment;

FIGS. 7A to 7D are views illustrating a method for patterning a thinfilm via a printing method employing the roll mold of the presentinvention according to a third embodiment; and

FIG. 8 is a perspective view illustrating a liquid crystal display panelformed via the method of fabricating a thin film pattern according tothe present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, the present invention will be described with reference tothe annexed drawings.

FIG. 2 is a perspective view illustrating a printing or imprintingdevice for forming a thin film pattern according to the presentinvention.

The printing or imprinting device in FIG. 2 includes a printing liquidsupplier 120 and a roll mold 140.

The printing liquid supplier 120 stores a printing liquid. The storedprinting liquid is supplied to a roll mold 140 using a printing method,or supplied to a substrate 101 using an imprinting method in the processof patterning the thin film.

The roll mold 140 rotates over a substrate 101 such that it contacts thesubstrate 101 conveyed by a conveyor 128. Alternatively, the roll mold140 may move so as to roll over the substrate 101 while the substrate101 is fixed.

A printing liquid from the printing liquid supplier 120 fills a grooveof the roll mold 140 by a printing method during the thin-filmpatterning process. The printing liquid in the groove of the roll mold140 is transcribed onto the substrate 101, while the roll mold 140 isrolled over the substrate 101.

In addition, the roll mold 140 is rolled over the substrate 101, towhich the printing liquid is applied, using an imprinting method duringthe thin-film patterning, such that it comes into contact therewith.

Such a roll mold 140 includes a base roller 144, an adhesive resin layer142, a buffer layer 148 and a mold surface layer 146.

The mold surface layer 146 is made of a photocurable material such asurethane-acrylate or polydimethylsiloxane. The mold surface layer 146 isformed so as to have a groove and a protrusion having the same shape asthe pattern to be formed on the substrate 101, or the reverse shapethereof.

The buffer layer 148 offsets stress applied from the roll mold to thesubstrate 101 when the roll mold 140 is rolled over the substrate 101and comes into planar contact with the base roller 144 in the process offabricating the roll mold 140.

The adhesive resin layer 142 adheres the base roller 144 to the bufferlayer 148. In addition, the adhesive resin layer 142 is formed of aphotocurable adhesive such as a sealant between the base roller 144 andthe buffer layer 148.

A light source 122, as a curing apparatus to cure the mold surface layer148 and the adhesive resin layer 142 is arranged in the base roller 144.The light source 122 produces ultraviolet light and is surrounded by alight source housing (represented by reference numeral “124” in FIG.3C). That is, the light source housing 124 surrounds the surface of thelight source 122, except for the surface of the light source 122 facingthe stage. At this time, the light source 122 and the light sourcehousing 124 do not rotate together the rotating base roller 144, insteadremaining stationary.

In addition, a camera (represented by reference numeral “126” in FIG.3C) to assist in aligning the base roller 144 is arranged in the baseroller 144. Specifically, the camera 126 aligns the base roller 144 whenthe base roller 144 is arranged on the buffer layer 148 and when thebase roller 144, to which the adhesive resin layer 142 has been applied,is arranged on the buffer layer 148. The camera 126 is removably mountedin the base roller 144, which is adhered in the process of alignment,and is detached after completion of alignment.

FIGS. 3A to 3E are sectional views illustrating a method for fabricatingthe roll mold illustrated in FIG. 2 according to a first embodiment.

As shown in FIG. 3A, a master pattern layer 112 having a groove pattern112 a and a protrusion pattern 112 b is formed on a master substrate 110having a flat surface. The master pattern layer 112 is formed byapplying an organic material, which can be stripped, such asphotoresist, and patterning the material through photolithography,holographic lithography, laser processing, electron beam processing,focused ion beam processing or the like. Meanwhile, the master patternlayer 112 and the master substrate 110 are separately formed, or amaster pattern whose surface has a groove pattern and a protrusionpattern may be formed by patterning the master substrate 110.

The master pattern layer 112 may be surface-treated with aself-assembled monolayer (SAM) to facilitate release (detachment) of themaster pattern layer 112 from the mold surface layer 146. Accordingly,adhesion of the masker pattern layer 112 to the roll mold 140 along themold surface layer 146 can be prevented, when the master pattern layer112 is released from the mold surface layer 146. The self-assembledmonolayer (SAM) is made of a hydrophobic material such asflurooctyl-trichloro-silane (FOTS) or(heptadecafluoro-1,1,2,3-tetrahydrodecyl)trichlorosilane (HDFS).

Then, as shown in FIG. 3B, a mold resin liquid is applied through afirst supply nozzle 132 onto the master pattern layer 112 to form a moldsurface layer 146. A lower surface of the mold surface layer 146 whichcontacts the master pattern layer 112 is formed into a protrusion-grooveshape along a protrusion 112 b and a groove 112 a of the mask patternlayer 112. The mold surface layer 146 has a flat upper surface and isformed into a protrusion-groove shape along a protrusion 112 b and agroove 112 a of the mask pattern layer 112. The mold surface layer 146is made of a photocurable mold resin liquid such as urethane-acrylate orpolydimethylsiloxane.

Then, as shown in FIG. 3C, the buffer layer 148, which is rolled on arewinder 118 and an unwinder 116 and thus maintains a parallel state, isaligned with the mold surface layer 146. Then, both sides of the baseroller 114 are aligned on the buffer layer 148 through an alignment key(not shown) and the camera 126 formed in at least one of a stage 130, amaster substrate 110, a master pattern layer 112 and a mold patternlayer 146. The camera 126 performs imaging to confirm whether analignment key arranged at both sides of the base roller 144 correspondsto both sides of the base roller 144, thus improving alignment accuracy.

The base roller 144 aligned on the buffer layer 148 is rolled over thebuffer layer 148. Accordingly, printing pressure generated by therotation of the base roller 144 is applied to the buffer layer 148 andtension is applied to the buffer layer 148 through the rewinder 118 andthe unwinder 116. In addition, the mold surface layer 146 is curedthrough the light source 122 arranged in the base roller 144 rotating onthe buffer layer 148.

Meanwhile, the base roller 144 of the present invention is rolled overthe buffer layer 148, while the base roller 144 comes into planarcontact with the solid buffer layer 148. In this case, the base roller144 does not slide on the cured solid buffer layer 148 and alignmentaccuracy between the buffer layer 148 and the base roller 144 isimproved, thus improving pattern accuracy. In addition, the solid bufferlayer 148 comes into planar contact with the base roller 144, thusrelatively increasing the contact area between the buffer layer 148 andthe base roller 144, and curing the mold surface layer 146 even with alow amount of light and in a relatively short period of time.

On the other hand, a conventional base roller rotates while directlycontacting a liquid mold surface layer without any buffer layer andcoming into linear contact with the liquid mold surface layer. In thiscase, the base roller may slide on the uncured liquid mold surfacelayer, thus reducing alignment accuracy between the buffer layer and thebase roller and reducing pattern accuracy. In addition, the liquid moldsurface layer comes into linear contact with the base roller, thusrelatively reducing the contact area between the buffer layer and thebase roller and necessitating curing of the mold surface layer with ahigh amount of light for a relatively long time.

Next, as shown in FIG. 3D, the buffer layer 148 is cut to the same sizeas the mold surface layer 146 through a dicing process using a dicingunit (not shown) to obtain a flat panel mold including the mold surfacelayer 146 and buffer layer 148. At the same time or after a while, theadhesive resin layer 142 is applied onto the base roller 144 through asecond supply nozzle 134. The adhesive resin layer 142 may be applied tothe base roller 144 through the first supply nozzle 132 shown in FIG.3B, instead of through the second supply nozzle 134.

Next, as shown in FIG. 3E, the base roller 144, to which the adhesiveresin layer 142 is applied, is rolled over the buffer layer 148. At thesame time, a light source 122 arranged in the base roller 144 is turnedon and the adhesive resin layer 142 is cured through light emitted fromthe light source 122. Accordingly, the flat panel mold including themold surface layer 146 and the buffer layer 148 is adsorbed and fixed onthe base roller 144 through the adhesive resin layer 142 to obtain aroll mold 140 having a groove and protrusion.

FIGS. 4A to 4D are sectional views illustrating a method for fabricatingthe roll mold shown in FIG. 2 according to a second embodiment. Thissecond embodiment is different from the first embodiment in that themold surface layer 146 and the adhesive resin layer 142 aresimultaneously cured.

Specifically, as shown in FIG. 4A, a master pattern layer 112 having agroove pattern 112 a and a protrusion pattern 112 b is formed on amaster substrate 110 having a flat surface. The master pattern layer 112having a groove pattern 112 a and a protrusion pattern 112 b is formedon a master substrate 110 having a flat surface. Next, as shown in FIG.4B, a mold resin liquid is applied onto the master pattern layer 112through the first supply nozzle 132 to form a mold surface layer 146.Next, as shown in FIG. 4C, the buffer layer 148 which is rolled on arewinder 118 and an unwinder 116, and thus maintains a parallel state,is formed on the mold surface layer 146. Next, the buffer layer 148 iscut to the same size as the mold surface layer 146 through a dicingprocess using a dicing unit (not shown) to obtain a flat panel moldincluding the mold surface layer 146 and buffer layer 148. At the sametime or after a while, the adhesive resin layer 142 is applied throughthe second supply nozzle 134 onto the base roller 144.

Next, as shown in FIG. 4D, both sides of the base roller 114, to whichthe adhesive resin layer 142 is applied, are aligned on the buffer layer148 using an alignment key (not shown) and the camera 126 formed on atleast one of a stage 130, a master substrate 110, a master pattern layer112 and a mold pattern layer 146. Next, a light source 122 arranged inthe base roller 144 is turned on and the adhesive resin layer 142 iscured through light emitted from the light source 122. Accordingly, theflat panel mold including the mold surface layer 146 and buffer layer148 is adsorbed and fixed on the base roller 144 through the adhesiveresin layer 142 to obtain a roll mold 140 having a groove andprotrusion.

FIGS. 5A to 5C are views illustrating a method for patterning a thinfilm via an imprinting method employing the roll mold of the presentinvention according to a first embodiment.

As shown in FIG. 5A, a printing liquid 102 is applied to a substrate 101through a printing liquid supplier 120. Then, as shown in FIG. 5B, aroll mold 140 including a base roller 144, an adhesive resin layer 142,a buffer layer 148 and a master pattern layer 146 is aligned on thesubstrate 101. Next, the roll mold 140 is rolled over the substrate 101.At this time, the printing liquid 102 is cured through a curingapparatus, such as a UV lamp, provided in the base roller 144 of theroll mold 140, or a curing apparatus provided on the rear surface of thesubstrate 101. As a result, as shown in FIG. 5C, the printing liquid 102is formed in the form of a thin film pattern 104 on the substrate 101.

FIGS. 6A to 6C are views illustrating a method for patterning a thinfilm via a printing method employing the roll mold of the presentinvention according to a second embodiment.

As shown in FIG. 6A, a roll mold 140 including a base roller 144, anadhesive resin layer 142, a buffer layer 148 and a master pattern layer146 is provided. The printing liquid 102 supplied from the printingliquid supplier 120 fills the groove of the roll mold 140.

Next, as shown in FIG. 6B, the roll mold 140 filled with the printingliquid 102 is rolled over the substrate 101. Accordingly, the printingliquid 102 is cured through a curing apparatus, such as a UV lamp,provided in the base roller 144 of the roll mold 140, or a curingapparatus provided on the rear surface of the substrate 101.Accordingly, the printing liquid 102 is transcribed, dried and cured onthe substrate 101 and is thus formed into a thin film pattern, as shownin FIG. 6C.

FIGS. 7A to 7D are views illustrating a method for patterning a thinfilm via a printing method employing the roll mold of the presentinvention according to a third embodiment.

As shown in FIG. 7A, a roll mold 140 including a base roller 144, anadhesive resin layer 142, a buffer layer 148 and a master pattern layer146 is provided. The printing liquid 102 supplied by the printing liquidsupplier 120 fills the groove of the roll mold 140.

Next, as shown in FIG. 7B, the printing liquid 102 is transcribed to atranscription roller 106, which rotates, and, at the same time, isengaged in the roll mold 140. The transcription roller 106 provided withthe printing liquid 102 is rolled over the substrate 101, as shown inFIG. 7C. Accordingly, the printing liquid 102 is transcribed, dried andcured on the substrate 101 and is thus formed into a thin film pattern,as shown in FIG. 7D.

As such, the thin film pattern 104 shown in FIGS. 5C, 6C and 7D may beused to form thin or thick films on flat panel display devices such asplasma display panels, electroluminescent (EL) display panels and fieldemission display devices as well as liquid crystal display panels.

Specifically, the liquid crystal display panel according to the presentinvention shown in FIG. 8 includes a thin film transistor substrate 180and a color filter substrate 160 such that a liquid crystal layer 171 isinterposed between the thin film transistor substrate 180 and the colorfilter substrate 160.

The color filter substrate 160 includes a black matrix 164, a colorfilter 166, a common electrode 168 and a column spacer (not shown)arranged on an upper substrate 162 in this order.

The thin film transistor substrate 180 includes a plurality of gatelines 186 and a plurality of data lines 184 which cross each other on alower substrate 182, a thin film transistor 188 adjacent to eachintersection between the gate lines 186 and the data lines 184, and apixel electrode 170 formed at a pixel region provided by theintersection.

An organic pattern used as a mask for patterning a thin film patternmade of an organic material such as the color filter 166, the blackmatrix 164 and the column spacer of the liquid crystal display panel andfor patterning a thin film pattern made of an inorganic material such asthe thin film transistor 188, gate lines 186, data lines 184 and pixelelectrode 170 of the liquid crystal display panel may be formed by aprinting process using the roll mold according to the present invention.

The present invention forms a roll mold using application andtranscription processes without using any conventional etching process,thus reducing fabrication process complexity and costs, and preventingdimensional variation of a roll mold caused by the etching process. Inaddition, a process for forming a flat panel mold and a process foradhering the flat panel mold to a base roller are performed in oneapparatus in an inline manner. In addition, according to the presentinvention, the adhesive resin layer and the mold surface layer are curedby at least two light-exposure processes using a light source arrangedin a base roller, thus reducing fabrication time and cost. In addition,according to the present invention, the base roller rotates and, at thesame time, the flat panel mold is adhered to the base roller, thusincreasing the thickness of the flat panel mold and pattern uniformity.In addition, according to the present invention, the roll mold is formedunder the conditions of the same tension, roll pressure and heat as in aroll-to-roll imprinting process in which the roll mold rotates to form athin film pattern, thus compensating for substrate deformation due totension, pressure and heat in the roll-to-roll imprint process.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A method for fabricating a thin film pattern,comprising: providing a roll mold comprising a base roller provided witha light source, an adhesive resin layer formed on the base roller, abuffer layer formed on the adhesive resin layer, and a mold surfacelayer having a groove-protrusion shape formed on the buffer layer;forming a printing liquid on the roll mold or the substrate; and rollingthe roll mold over the substrate to form a thin film pattern on thesubstrate, wherein the providing a roll mold comprises: providing asubstrate provided with a master pattern layer; sequentially forming amold surface layer and a solid buffer layer on the substrate providedwith the master pattern layer to provide a flat panel mold; forming anadhesive resin layer on a base roller aligned on the flat panel mold;and rolling the base roller provided with the adhesive resin layer overthe flat panel mold to adhere the flat panel mold to the base rollerthrough the adhesive resin layer, wherein the providing of the flatpanel mold comprises: forming the mold surface layer on the masterpattern layer; forming the buffer layer on the mold surface layer, whileone end of the buffer layer is adhered to an unwinder and the other endof the buffer layer is adhered to a rewinder, and keeping the bufferlayer level; and cutting the buffer layer to a size of the mold surfacelayer, wherein the mold surface layer and the adhesive resin layer arecured through light emitted from the light source arranged in the baseroller.
 2. The method according to claim 1, wherein the mold surfacelayer is made of a photocurable mold resin such as urethane-acrylate orpolydimethylsiloxane, the buffer layer is formed of a flexiblesubstrate, and the adhesive resin layer is made of a photocurableadhesive.
 3. The method according to claim 1, wherein the surface of themaster pattern layer contacting the mold surface layer issurface-treated with a hydrophobic material comprising at least oneselected from flurooctyl-trichloro-silane (FOTS) and(heptadecafluoro-1,1,2,3-tetrahydrodecyl)trichlorosilane (HDFS).
 4. Themethod according to claim 1, wherein the providing of the flat panelmold further comprises: subsequent to forming the buffer layer on themold surface layer, rolling the base roller over the buffer layer,wherein the mold surface layer is cured when rolling the base rollerover the buffer layer, and wherein the adhesive resin layer is curedwhen rolling the base roller provided with the adhesive resin layer overthe flat panel mold.
 5. The method according to claim 1, wherein themold surface layer and the adhesive resin layer are simultaneously curedusing the light source arranged in the base roller when rolling the baseroller provided with the adhesive resin layer over the flat panel mold.